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Label Anti-Overlapping problem solution (@ Eurocontrol) [pdf]
Metallization of insulators (plastics) using polypyrrole as precoat (@ 55th ISE)
Polypyrrole-modified ABS and FR4 electrodes for use in insulators' metallization (@ WSEAS Venice 2006)
Copper electrodeposition on FR4 for the production of Printed Circuit Boards (@ 6th Panhellenic Chemical Engineering Conference)
Advanced Materials: Use of Polypyrrole in Printed Circuit Boards (PCB) [Google Knol resource]
Polypyrrole-Based Metallization of Insulators – An application to Printed Circuit Boards (PCB) (@ WSEAS 2008)
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